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![handle is hein.crs/tnsrligbl0001 and id is 1 raw text is:
Taiwan's Role in Global Semiconductor
Supply Chains
uctors are a uniquely important strategic technology that is broadly
>f and fundamental to nearly all modern industrial and national
:tivities. They are essential building blocks of other technologies
:ial intelligence, autonomous systems, 5G communications, and
:omputing). Many policymakers see U.S. strength in semiconductor
y and fabrication (manufacturing), along with secure supply chains,
U.S. economic and national security interests. The CHIPS and
:t (P.L. 117-167) appropriated $52.7 billion in federal funding until
and provided tax incentives to expand U.S. semiconductor
a capacity.
key link in U.S. and global technology supply chains, and Taiwan firms are
parts of the semiconductor industry: research and development (R&D);
-ication (fabs); materials (e.g., silicon wafers); and assembly, packaging, and
F). About 90% of global advanced semiconductor chip production is based
id produced by Taiwan's leading foundry company-Taiwan
ctor Manufacturing Company Ltd. (TSMC).Taiwan's second-largest chip
n-United Microelectronics Corporation (UMC)-has about one-third the
TSMC, and focuses on the production of mature-generation chips.
iartered Apple Inc. and Nvidia Corporation are among TSMC's top
TSMC has invested in three fabs in Arizona (supported by $6.6 billion in
;cience Act funds) and has said it will invest another $100 billion in three
io APT facilities, and an R&D center. TSMC is reportedly considering
U.S.-based Intel's foundry business.
Foundries by Location
Hsinchu Science
Park, Hsinchu City
AB, Fab 1, 2,3,5, 8,
12A, 12B, New Fab
Hsinchu County
Global R&D Center
Miaoli County-
AB, Fab 6
Central Taiwan
Science Park, Taichung City
AB,Fab5,15A,15B,NewFab
Taiwan Strait Chi
Penghu
Qundaoo
(Pescardore )
South Chino Sea
Kaohsiung Science Park,
Kaohsiung City
New Fab
TSMC's Global Presence
Dresden, Germany ESMC
~ (12, 16, 22, 28nm)] KL
Camas. USA Fab 11i1
East China Sea
-Taoyuan City
AB, Fab 3
Plien
wiung
r PhI~pm Sea
Taiwan's Share of Global
Semiconductor Industry
Taiwan Global Share
Design ($35.1 Billion)
Foundry ($79.9 Billion)
Rest of the World
Package and Testing ($18.7 Billion)
Source: CR5 with data from the Taiwan Semiconductor
Industry Association
Based on2023 production values
The process of producing a finished semiconductor chip
involves design and fabrication, followed by assembly,
testing, and packaging to prepare chips for final
integration into electronic devices.These stages often
occur across national borders among a small number of
economies that specialize in parts of the supply chain.
The industry relies on suppliers of materials, chemicals,
gases, and manufacturing equipment.
Semiconductor
- ~ Not to scale
Wafer
Semiconductors (or integrated circuits) are tiny
electronic devices (based primarily on silicon or
germanium) composed of billions of components that
can process, store, sense, and move data or
signals-essentially serving as the brains, memory,
sensors, communications, and power lines of electronic
devices. The many types of chips (e.g., logic, memory,
analog, optoelectronics, sensors, and discretes) perform
different functions and require specialized design and
manufacturing processes. A wafer is a flat, thin slice of
silicon material on which an integrated circuit is created.
Legend
Wafer Size
(Displayed by Color)
* 12-inch
* 8-inch
O 6-inch
o Wafer size not available
O Advanced backend (AB)
0 Proposed
LPhoenix, USA Fab 2
(3-4 nm)
Other Qualities
(Displayed by Shape)
HQ Corporate headquarters
(Fab 12 A/ GIGAFABI site)
O Global R&D center
* GIGAFAB* (very large, automated)
A Advanced packaging
* None
Notes: TSMC operations include 412-inch wafer GIGAFABs (130 nm to 7 nm process technology), Fabs 12 and 18 (3 nm process technology) and a Global R&D Center (2
nm process technology). TMSC has proposed 3 fabs (2 nm process technology) and a fourth new fab (1.4 nm process technology). UMC and U.S.-based Intel Corp. are
developing 12-nanometer(nm) technology for chip production in Arizona. TSMC's investment in Germany (ESMC) is ajoint venture with three Europe-based
semiconductor firms. TSMC's most advanced capabilities are located in Taiwan.
Wafer size refers to the diameter of a wafer used in semiconductor fabrication. Process node describes the size of the transistor gate length as measured in
billionths of a meter, or nanometers (nm). Generally, the smaller the node size, the more advanced the technology. For some types of chips, process node may
not be an indication of performance. Fabrication facilities are called fabs.
Information as of March 11, 2025. Prepared by Karen Sutter, Specialist in Asian Trade and Finance; Cassandra Higgins, Geospatial
Information Systems Analyst; and Juan Pablo Madrid, Visual Information Specialist. - C R S](ViewImageLocal?handle=hein.crs/tnsrligbl0001&div=1&collection=&method=preview&ext=.png&size=3)